MedPCB manufactures medical PCBs using Shengyi S1000-2 high-Tg FR-4 laminates, with multilayer and HDI capabilities up to 40 layers.
• ISO 13485 Certified S1000-2 Medical PCB Manufacturing
• Shengyi S1000-2 with 180°C Tg (DSC) for Lead-Free Assembly
• Up to 40-Layer S1000-2 Multilayer PCB Manufacturing
• Excellent CAF Resistance & Low Z-Axis CTE
Shengyi S1000-2 is a high-performance FR-4 laminate produced by Shengyi Technology, with a Tg of 180°C by DSC. It is ideal for lead-free assembly and high-reliability multilayer PCBs, with low Z-axis CTE, excellent Anti-CAF performance, and low water absorption.
Medical electronics such as infusion pumps, patient monitors, and imaging systems can require higher thermal and reliability margins than standard FR-4 designs. The S1000-2 PCB material solves this with a proven high-Tg resin system and stable electrical and mechanical performance.
MedPCB provides high-precision S1000-2 PCB manufacturing and S1000-2 PCB fabrication for medical applications, supporting both prototypes and production orders.
We manufacture every medical bare board under a strict ISO 13485 quality system. Our team tracks every step of the S1000-2 PCB fabrication process to ensure full compliance with healthcare regulations.
Our engineering team reviews your Gerber files, stackup, and impedance requirements to identify potential manufacturing issues before production. We can also confirm whether the S1000-2 PCB material is the right choice for your design and recommend alternatives when needed.
We maintain established relationships with qualified material suppliers and flexible sourcing channels for S1000-2 laminates and prepregs. This helps us respond to material shortages and support your prototype and production requirements with greater supply flexibility.
We fabricate S1000-2 PCBs ranging from simple double-sided boards to 40-layer stacks with blind, buried, and stacked microvias, the equipment adapts to different S1000-2 PCB manufacturing needs.
Every lot passes AOI, electrical testing, and microsection analysis. We also support thermal stress testing, solder float testing, and other reliability verification under our ISO 13485 system.
| Layer Count | 1 to 40 Layers |
| Material Options | Shengyi S1000-2 laminate and matching prepreg |
| Finished Board Thickness | 0.2 mm to 10.0 mm |
| Board Size | • Min: 4 mm × 8 mm (Standard: 5 mm × 10 mm) • Max: 9 in × 23 in (Standard: 9 in × 14 in) |
| Minimum Trace and Space | 3 mil by 3 mil |
| Impedance Control Tolerance | Plus or minus 5 to 10 percent |
| Quality Standard | ISO 13485, IPC Class 2 and Class 3 |
| Via Technology | Through-Hole, Blind, Buried, and Stacked Microvias |
| Recommended Surface Finishes | ENIG, ENEPIG, HASL Lead-Free, and Immersion Silver |
| Available Alternative Materials | KB, Shengyi, Shengyi SF305, FR408, FR408HR, IS410, FR406, GETEK, 370HR, IT180A, Rogers RO4350B, Rogers RO4000 series, and selected PTFE laminates |
High-Tg resin systems require controlled temperature, pressure, and lamination time to achieve consistent curing and bonding quality.
Our Solution: We use controlled lamination profiles for S1000-2 and monitor key process parameters to maintain consistent bonding quality and cured thickness.
Differences in thermal expansion between copper and the laminate can stress plated through-hole barrels during assembly and field temperature cycling.
Our Solution: We control drilling parameters, desmear, and copper plating thickness, then verify PTH quality with microsection analysis and thermal stress testing (288°C solder dip per IPC-TM-650 2.4.13.1).
Material movement during lamination can shift layers and reduce alignment accuracy in complex multilayer S1000-2 stackups.
Our Solution: We apply scale-factor compensation, use laser direct imaging with fiducial alignment, and verify layer-to-layer registration with X-ray inspection after lamination.
CAF formation requires moisture, electrical bias, and a conductive path along glass fibers. Poor drilling or desmear control can create that path.
Our Solution: We control material handling, drilling, desmear, and hole spacing to reduce CAF-related reliability risks. CAF testing can also be arranged when required for design qualification.
The table below outlines the key S1000-2 material specifications and performance characteristics, extracted directly from the official Shengyi S1000-2 datasheet. Electrical values such as the S1000-2 dielectric constant and S1000-2 loss tangent are included for reference:
| Property / Item | Test Condition / Method | Typical Value |
|---|---|---|
| Glass Transition Temp (Tg) | DSC (IPC-TM-650 2.4.25) | 180°C |
| Decomposition Temp (Td) | 5% wt. loss (IPC-TM-650 2.4.24.6) | 345°C |
| CTE (Z-axis) | Before Tg (IPC-TM-650 2.4.24) | 45 ppm/°C |
| Thermal Time to Delamination | T288 via TMA (IPC-TM-650 2.4.24.1) | 20 min |
| Dielectric Constant (Dk) | 1MHz (IPC-TM-650 2.5.5.9) | 4.8 |
| Dissipation Factor (Df) | 1MHz (IPC-TM-650 2.5.5.9) | 0.013 |
| Water Absorption | E-1/105+D-24/23 (IPC-TM-650 2.6.2.1) | 0.10% |
| Flammability | UL94 (E-24/125) | V-0 |
Need a Shengyi S1000-2 PCB for your medical device? Send us your Gerber files for a free DFM review and quote.
A client needed a dense 12-layer main board that could withstand lead-free assembly and constant field use. We fabricated it on S1000-2 with ENIG finish, and it passed full thermal stress testing and 100% electrical test with zero defects.
We built a 16-layer halogen-free S1000-2 backplane for a diagnostic imaging console. Controlled lamination parameters and X-ray registration checks delivered accurate layer alignment across the full panel.
A wearable cardiac monitor required a compact HDI board. We delivered an ultra-thin S1000-2 design with laser-drilled stacked microvias, meeting tight thickness targets while preserving full electrical performance.
For a safety-critical infusion pump, we fabricated a CAF-resistant control board on S1000-2 and supported qualification with 85°C/85% RH testing. The boards passed without shorts, confirming long-term reliability in humid environments.
Our Medical S1000-2 PCB FAQ addresses key questions regarding material properties and fabrication standards. We cover high-Tg FR-4 characteristics (180°C Tg), lead-free assembly performance, CAF resistance, Z-axis thermal expansion, multilayer and HDI capabilities up to 40 layers, strict ISO 13485 quality compliance, and DFM support. For every medical S1000-2 PCB project, we guarantee high-precision bare board manufacturing engineered for critical healthcare applications.
Standard FR-4 typically has a Tg of 130°C-150°C with higher Z-axis thermal expansion, limiting thermal tolerance during lead-free assembly. Shengyi S1000-2 offers 180°C Tg and lower Z-axis CTE, expanding your process window and preserving via integrity through multiple reflow cycles. It provides strong CAF performance and long-term reliability suitable for medical electronics.
| Criteria | Standard FR-4 | S1000-2 |
|---|---|---|
| Tg (DSC) | 130 to 150°C | 180°C |
| Dk / Df @ 1 MHz | 4.5 to 4.8 / 0.017 to 0.020 | 4.8 / 0.013 |
| Lead-Free Assembly | Marginal | Excellent |
| CAF Resistance | Moderate | Excellent |
| Cost | Low | Moderate |
| Best For | Consumer and simple designs | Reliable medical multilayer PCBs |
4–40 layers
Standard: 500 × 600 mm (19" × 23") Advanced: 1100 × 500 mm (43" × 19")
High-Tg FR4, Rogers, Polyimide, Megtron, Taconic, Arlon
4–40 layers
Supports 1+N+1, 2+N+2, and Any-Layer HDI
Microvias, Fine Lines, and Sequential Lamination
1 to 8 Layers
Static 3-6x (1L) | Dynamic 20-40x
Polyimide (PI), FR4, 3M Tape
01005 (0.4mm*0.2mm)
Support SMT & Thru-hole
Turnkey, Partial turnkey, Consigned
High Thermal Stability & Low Moisture Absorption
Dk 3.5 & Low Df for Low-Loss Signal Transmission
ISO 13485, IPC Class 2 and Class 3
Isola 370HR HDI Technology and Lead-Free Assembly
180°C Tg and 340°C Td
ISO 13485, IPC Class 2 and Class 3
English
French
German
Japanese
Korean
