MedPCB provides precision PCB manufacturing and assembly for compact implantable medical electronics. We support HDI, ultra-thin flex, rigid-flex, miniature component assembly, and controlled production under an ISO 13485 quality management system.
✓ HDI, Ultra-Thin Flex & Rigid-Flex PCB Manufacturing
✓ Miniature Components & Fine-Pitch SMT Assembly
✓ Component Sourcing, Inspection & Functional Testing
✓ ISO 13485 Manufacturing & IPC Class 2/3 Support
An implantable device PCB is a specialized circuit board used inside electronic medical implants. It provides electrical connections between components and supports functions such as sensing, power management, signal processing, communication, and device control.
Implantable device electronics must fit into small spaces and maintain stable performance. Depending on the device design, the PCB may require compact layouts, fine-pitch components, flexible or rigid-flex construction, and suitable material options for the application.
MedPCB manufactures and assembles medical-grade PCBs for implantable medical devices. We support HDI, rigid, flex, and rigid-flex PCB manufacturing, with precision SMT, fine-pitch assembly, component inspection, and testing. We support prototypes, low and high-volume manufacturing.
MedPCB manufactures and assembles medical-grade PCBs under an ISO 13485 quality management system. Our process supports controlled production, material traceability, and inspection from prototypes to volume manufacturing.
MedPCB supplies PCB materials from approved suppliers based on the required board design and application. Material options can include high-Tg FR-4, polyimide, Rogers, and other materials suitable for medical electronics. We maintain material and component traceability throughout production and can suggest alternative materials during DFM review when needed.
We manufacture flex and rigid-flex PCBs for compact medical devices that require flexible circuit sections. These constructions support compact layouts and reliable connections in applications with movement or limited space.
MedPCB provides precision SMT, THT, and mixed-technology PCBA for implantable device electronics. Our 8 SMT assembly lines support small components, fine-pitch packages, and compact PCB layouts. Turnkey assembly includes component sourcing, PCB assembly, inspection, and testing based on your requirements.
Our engineering team reviews PCB layout, component placement, spacing, vias, materials, and assembly requirements before production. This helps identify manufacturing issues early and supports reliable implantable device PCB production.
Technical Parameter | Manufacturing Capability |
Order Quantity | ≥ 1 PCS, No MOQ |
Board Size | Standard: up to 500 × 600 mm; Advanced: up to 1100 × 500 mm |
Layer Count | Rigid PCB: 1–40 layers Flex PCB: 1–8 layers Rigid-Flex PCB: Standard: 2–12 layers (up to 10 flex layers); Advanced: 13–20 layers (up to 18 flex layers) |
PCB Types | Rigid, Flex, Rigid-Flex, HDI, Heavy Copper, Metal Core, and Aluminum PCB |
Assembly Technologies | Surface Mount (SMT), Through-Hole (THT/DIP), and Mixed-Technology |
Component Sourcing | Full Turnkey, Partial Turnkey, or Consigned; access to 300,000+ genuine traceable components |
Component Range | 01005 packages to 0.2 mm fine-pitch BGA |
Placement Accuracy | ±0.035 mm via automated component placement |
Board Thickness | 0.2–10.0 mm; Standard: 0.2–3.2 mm; Advanced: 3.4–10.0 mm |
Min. Trace Width / Spacing | Internal: 3/3 mil (0.075 mm); External: 3/3 mil advanced, 3.5/4 mil standard |
Surface Finish | ENIG, ENEPIG, Lead-Free HASL, OSP, Immersion Silver, Immersion Tin, Soft/Hard Gold |
Impedance Tolerance | ±5 Ω for <50 Ω; ±10% for ≥50 Ω |
Materials | Polyimide, Ceramic, High-Tg FR-4, Rogers, Megtron 6, and other qualified materials for implantable device PCBs. |
We manufacture your PCBs according to the approved design and fabrication specifications. Production includes imaging, etching, drilling, plating, lamination, surface finishing, and electrical testing, as applicable to the PCB construction. Meanwhile, BOM components are sourced through qualified supply channels. Any proposed component alternatives require customer approval before procurement.
Challenge: Implantable devices may experience repeated movement and mechanical stress inside the body. Rigid circuits can develop cracks or connection failures when used in areas that require flexibility.
Our Solution: MedPCB manufactures flex and rigid-flex PCBs using suitable flexible materials such as polyimide. Proper layer construction, bend areas, and component placement help support reliable operation under mechanical movement.
Challenge: Implantable devices have limited space for electronics. Dense circuits may require fine traces, microvias, small pads, and closely spaced features. These designs require precise PCB fabrication to maintain electrical connections and board reliability.
Our Solution: MedPCB supports HDI PCB fabrication with fine-line circuitry, microvias, and compact multilayer structures. Our manufacturing process includes controlled drilling, imaging, plating, and inspection for small and dense PCB features.
Challenge: Implantable PCBAs may use 01005 components, fine-pitch BGAs, miniature sensors, and other small packages. Small solder joints require accurate placement and controlled soldering to reduce assembly defects.
Our Solution: MedPCB supports 01005 SMT assembly and fine-pitch BGA placement with placement accuracy up to ±0.035 mm. 3D SPI, AOI, 3D X-ray, electrical testing, and functional testing can be applied based on the PCBA requirements.
Challenge: Implantable electronics require controlled manufacturing and careful handling. Residues, contamination, or incomplete component records can affect product reliability and make production records difficult to review.
Our Solution: MedPCB manufactures medical PCBs and PCBAs under an ISO 13485 quality management system. We maintain material and component traceability and use controlled inspection processes throughout production. Cleaning and inspection requirements can be defined based on the device and assembly requirements.
PCB Inspection & Electrical Testing
We inspect implantable medical PCBs during fabrication using AOI, dimensional inspection, and electrical testing. Critical board features, materials, and fabrication details are checked against approved specifications.
PCBA Process Inspection
We inspect component placement, solder joints, and assembly quality throughout production. 3D SPI checks solder paste before placement. AOI verifies component position, polarity, and visible solder defects. 3D X-ray inspects hidden connections on BGAs, QFNs, and other fine-pitch components.
Functional Testing & Traceability
We perform electrical and functional testing based on the approved test requirements. Tests can cover power circuits, sensor interfaces, signal transmission, communication circuits, and other device functions. Production and inspection records are maintained for component and process traceability.
Need reliable Implantable Medical PCB & PCBA? Send your Gerber files, BOM, and assembly files to sales@medicalpcb.com for a free DFM/DFA review.
The customer required a compact HDI multilayer PCB for heart rhythm sensing and pulse generation. MedPCB manufactured the multilayer HDI PCB with 01005 components and fine-pitch assembly for the sensor and control circuits. Our precise SMT placement supports the small component spacing and compact layout.
The customer required a rigid-flex PCB for sound processing and electrode control in a compact implantable assembly. MedPCB manufactured the board with multilayer rigid-flex construction, polyimide flex sections, fine-line circuitry, and microvias. The PCBA used fine-pitch ICs and miniature SMT components, using ±0.035 mm via automated component placement.
The customer required a compact multilayer PCB for pulse generation, battery management, and multi-channel stimulation. MedPCB manufactured the board with controlled-impedance traces, fine-line routing, microvias, and high-Tg PCB materials based on the approved design. We applied selective conformal coating to specified PCBA areas for extra environmental protection.
The customer required a low-power, high-reliability PCB for micro-pumps, fluidic sensors, and wireless programming circuits. We manufactured the board using ultra-thin multilayer substrates. Fine-pitch SMT assembly supports the compact layout, while conformal coating was applied to selected areas where additional moisture protection was required.
The customer required a flexible, ultra-miniature PCB for electrochemical biosensors, micro-controllers, and Bluetooth transmission circuits. MedPCB manufactured the board using thin-film flexible polyimide substrates to withstand mechanical movement. High-precision SMT assembly and low-leakage circuit designs ensure continuous, accurate sensor monitoring and battery performance.
Our Implantable Device PCB FAQ addresses key questions about PCB manufacturing and assembly for implantable medical electronics. We cover rigid, flex, and rigid-flex PCB fabrication, biocompatible materials, compact multilayer designs, fine-pitch SMT assembly, and controlled component placement for space-limited devices. We also cover ISO 13485 manufacturing, material traceability, protective coatings, encapsulation requirements, and inspection from prototypes to volume production. For every implantable device PCB project, we provide controlled fabrication and assembly based on the device size, circuit density, power requirements, and long-term operating conditions.
Rigid, HDI & Rigid-Flex PCB Options for Compact Devices
100% Electrical Testing, AOI, 3D X-Ray, And Functional Testing
ISO 13485 Manufacturing & IPC Class 2/3 Support
High-Tg, Heavy Copper & Thermal Management PCB Options
SMT, THT & Mixed-Technology PCBA
ISO 13485 Manufacturing & IPC Class 2/3 Support
1–40 layers
3 mil / 3 mil
ISO 13485, IPC Class 2 and Class 3
Multilayer & HDI PCB Fabrication
Turnkey Component Sourcing & SMT/THT PCBA
ISO 13485 & IPC Class 2/3 PCB & PCBA Manufacturing
Rigid, Flex, HDI & Rigid-Flex PCB Options
Fine-Pitch SMT Assembly for Compact Endoscope PCBAs
ISO 13485 & IPC Class 2/3 PCB & PCBA Manufacturing
1 to 40 Layers
3 mil / 3 mil
24 to 48 hours for rapid prototypes
No MOQ
+/-0.035mm
01005 (0.4mm*0.2mm)
>20 W/m·K
>170 W/m·K
DPC, LTCC, HTCC, DBC, and AMB
High-Precision SMT, Low-Temperature Reflow, Selective Soldering
Micro-SMD, Fine-Pitch BGAs, Connectors, QFNs, Sensors
Single-Sided Flex, Double-Sided Flex, Multi-Layer Flex
1 to 8 Layers
Static 3-6x (1L) | Dynamic 20-40x
Polyimide (PI), FR4, 3M Tape
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