PCBs for Medical Diagnostic Equipment
PCBMay manufactures medical diagnostic PCBs designed for accuracy, stability, and long-term reliability in regulated healthcare environments.
Certifications
PCBMay manufactures medical diagnostic PCBs designed for accuracy, stability, and long-term reliability in regulated healthcare environments.
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8-layer
Immersion Gold
Standard: 1–20 layers (0.2–3.2 mm) | Advanced: 22–40 layers (3.4–10 mm)
Outer: Down to 3.5/3.5 mil | Inner: Down to 3/3 mil
Standard: 1/2 oz min to 4 oz max | Advanced: Up to 10 oz max
Shengyi SH260 (Laminate/Prepreg) | Rigid Polyimide Copper Clad Laminate
Rigid: 1+n+1 to 3+n+3 (buried vias ≤ 0.3 mm) | Flex: 1+n+1 with microvias
Rigid: Down to 3/3 mil | Flex: Down to 2/2 mil
Flex PCB: Up to 8 layers & Rigid-Flex PCB: Up to 20 layers
Flex PCB: 0.5–0.8 mm (without stiffener) & Rigid-Flex PCB: 0.3–4.0 mm
HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Immersion Silver, Immersion Tin, and OSP
1-20 layers standard, 22-40 layers advanced
± 10% (≥ 50 ohm) standard, ± 5 ohm (< 50 ohm) advanced
HASL Lead-Free, OSP standard; ENIG, ENEPIG, Immersion Ag / Sn advanced
DuPont Pyralux AP FCCL (PI 1–4 mil, Cu 0.5–2 oz)
2.8/2.7 mil (0.5 oz Cu)
4 mil (0.10 mm)
up to 40 layers
4/4 mil (Standard) | 3/3 mil (Advanced)
ENIG, ENEPIG, Immersion Silver/Tin, Lead-Free HASL, Hard/Soft Gold, OSP, and hybrid combination finishes
1–4 layers
Min ½ OZ, Max 4 OZ standard; Min ⅓ OZ, Max 100 OZ advanced
Aluminum, FR4, copper, ceramic, polyimide, polyester, glass, and hybrid laminates
1–4 layers
Min ½ OZ, Max 4 OZ standard; Min ⅓ OZ, Max 100 OZ advanced
Aluminum, FR4, copper, ceramic, polyimide, polyester, glass, and hybrid laminates
HDI, Rigid-Flex, and Heavy Copper PCB Manufacturing
Fine-Pitch SMT & Mixed-Technology PCBA
ISO 13485 Manufacturing & IPC Class 2/3 Support
Rigid, HDI & Rigid-Flex PCB Options for Compact Devices
100% Electrical Testing, AOI, 3D X-Ray, And Functional Testing
ISO 13485 Manufacturing & IPC Class 2/3 Support
HDI, Ultra-Thin Flex & Rigid-Flex PCB Manufacturing
Miniature Components & Fine-Pitch SMT Assembly
ISO 13485 Manufacturing & IPC Class 2/3 Support
HDI, High-Frequency and High Tg PCB Manufacturing
Placement Accuracy of ±0.035 mm & Fine-Pitch SMT Assembly
Consignment, Full & Partial Turnkey
Ultra-Thin Flex, Rigid-Flex & HDI PCB Manufacturing
Ultra-Fine Pitch Assembly Capability for Wearable Heart Rate Monitor PCB
Consignment, Full & Partial Turnkey
High-Tg, Heavy Copper & Thermal Management PCB Options
SMT, THT & Mixed-Technology PCBA
ISO 13485 Manufacturing & IPC Class 2/3 Support
1–40 layers
PTFE-based laminates from qualified suppliers, including Rogers and Taconic, as well as ceramic-filled PTFE systems
3 mil by 3 mil
1–40 layers
3 mil / 3 mil
ISO 13485, IPC Class 2 and Class 3
High Thermal Stability & Low Moisture Absorption
Dk 3.5 & Low Df for Low-Loss Signal Transmission
ISO 13485, IPC Class 2 and Class 3
Isola 370HR HDI Technology and Lead-Free Assembly
180°C Tg and 340°C Td
ISO 13485, IPC Class 2 and Class 3
Multilayer & HDI PCB Fabrication
Turnkey Component Sourcing & SMT/THT PCBA
ISO 13485 & IPC Class 2/3 PCB & PCBA Manufacturing
Multilayer & HDI PCB Fabrication
Turnkey Component Sourcing & SMT/THT PCBA
ISO 13485 & IPC Class 2/3 PCB & PCBA Manufacturing
Rigid, Flex, HDI & Rigid-Flex PCB Options
Fine-Pitch SMT Assembly for Compact Endoscope PCBAs
ISO 13485 & IPC Class 2/3 PCB & PCBA Manufacturing
3.38 +/- 0.05
0.0027 at 10 GHz
46 ppm/°C
3.48 +/- 0.05
0.0037 at 10 GHz
32 ppm/°C
Panasonic MEGTRON 6 R-5775/R-5670
Ultra-Low Transmission Loss & High Heat Resistance
ISO 13485, IPC Class 2 and Class 3
HDI and Multilayer PCB Manufacturing
High-Frequency Laminates and Materials Available
100% Electrical Testing, AOI, 3D X-Ray, and Functional Testing
HDI and multilayer PCB manufacturing up to 40 layers
Turnkey Component Sourcing and SMT/THT PCBA
ISO 13485 medical manufacturing with DFM/DFA support
1–40 layers
3/3 mil
1 PCS to Mass Production
1 to 40 Layers
3 mil / 3 mil
24 to 48 hours for rapid prototypes
RO4000 Series, RO3000 Series, RT/duroid Series, TMM Series
Up to 40 layers
IPC Class 2, Class 3 & ISO 13485
1–4 layers
Up to 5 W/m·K
35 µm–240 µm (1 OZ–7 OZ)
1 to 8 Layers
Static 3-6x (1L) | Dynamic 20-40x
Polyimide (PI), FR4, 3M Tape
High-Precision SMT, Low-Temperature Reflow, Selective Soldering
Micro-SMD, Fine-Pitch BGAs, Connectors, QFNs, Sensors
Single-Sided Flex, Double-Sided Flex, Multi-Layer Flex
High-Power LEDs, CSP LEDs, Micro-LEDs, RGB/RGBW LEDs, IR/UV LEDs, LED Drivers, Photodiodes, Sensors
Aluminum MCPCB (1–4 Layer), Copper-Core PCB, Ceramic PCB (Al₂O₃/AlN), Flex LED Strips, Rigid-Flex LED Boards
Aluminum (5052/6061), Copper, Alumina (Al₂O₃), Aluminum Nitride (AlN), FR4 with Thermal Vias
Manual Soldering, Dual-Wave Soldering, Selective Soldering
Axial, Radial, SIP, DIP, Connectors, Relays, Transformers, Custom Heavy Parts
Rigid, Flex, Rigid-Flex, High-TG, Heavy Copper
+/-0.035mm
0.2mm
0.14mm
>20 W/m·K
>170 W/m·K
DPC, LTCC, HTCC, DBC, and AMB
01005 (0.4mm*0.2mm)
Turnkey, Partial Turnkey, Consigned
±0.035 mm
4–40 layers
Standard: 500 × 600 mm (19" × 23") Advanced: 1100 × 500 mm (43" × 19")
High-Tg FR4, Rogers, Polyimide, Megtron, Taconic, Arlon
4–40 layers
Supports 1+N+1, 2+N+2, and Any-Layer HDI
Microvias, Fine Lines, and Sequential Lamination
Rigid, Flexible, and Rigid-Flex
Turnkey, Partial Turnkey, Consigned
SMT, DIP/THT, and Mixed-Technology
±0.035 mm
Full, Partial & Kitted Consignment Supported
SMT, DIP/THT, and Mixed-Technology
No MOQ
Turnkey, Partial Turnkey, Consigned
Fast-Turn, Expedited Services and Pilot Builds
01005 (0.4mm*0.2mm)
Support SMT & Thru-hole
Turnkey, Partial turnkey, Consigned
Up to 100 oz
Heavy, Extreme & Mixed Copper
Embedded Copper Coin and Integrated Bus Bar
Up to 20 Rigid Layers, Up to 18 Flex Layers
Ultra-Long & Ultra-Thin HDI Rigid-Flex
Flex-to-Install & Dynamic Flex options
Up to 40 layers
Rogers, Isola, Panasonic, and Shengyi and more.
Mid-Tg 150°C, High-Tg 170°C +
Aluminum and Copper Core PCB
Up to 5.0 W/m·K
Single-Sided, Double-Sided, and Selected Multilayer
Rogers, Taconic, Arlon & PTFE-Based Materials
Up to 40 layers for complex RF and high-speed designs
4mil Laser Drilling & Ultra-Fine Lines
±0.035mm
01005 (0.4mm*0.2mm)
3 Million~4 Million Soldering Pad/day
No MOQ
+/-0.035mm
01005 (0.4mm*0.2mm)
No MOQ
+/-0.035mm
0201
Value1
test
test
Swiss CNC Turning
Titanium
Passivation
Swiss CNC Turning
Titanium
Passivation
Swiss CNC Turning
Titanium
Passivation
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