
A Medical High-Tg PCB uses high-temperature laminate materials designed to maintain stable performance under elevated heat. Standard FR-4 typically has a Tg of 130–140°C, while mid-Tg materials reach around 150–160°C and High-Tg materials reach 170°C or higher. The higher Tg improves resistance to thermal stress, moisture, and chemical exposure. You need a Medical High-Tg PCB when your medical device experiences repeated thermal cycling, high lead-free soldering temperatures, elevated operating temperatures, or other demanding conditions where standard FR-4 may not provide enough thermal reliability.
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Technical Parameter |
Standard Capability |
Advanced Capability |
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Layer Count |
1–20 layers |
22–40 layers |
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Base Materials |
Available materials include Shengyi, Isola, Panasonic, and other qualified suppliers, including S1000-2M, IT-180A, FR408HR, 370HR, IS410, and Megtron 6 etc.
For more material needs, please contact us directly. |
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PCB Types |
Rigid PCB, multilayer PCB, blind & buried vias, heavy copper power PCB |
HDI PCB, backplanes, backdrilled PCB, embedded capacitance/resistance structures |
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HDI Build Structure |
1+N+1, 2+N+2, 3+N+3 |
Any-Layer HDI, laser vias with copper filling and plating |
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Finished Board Thickness |
0.2–3.2 mm |
3.4–10.0 mm |
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Maximum Board Size |
500 × 600 mm |
1100 × 500 mm |
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Minimum Laser Drill Size |
4 mil (0.10 mm) |
4 mil (0.10 mm) |
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Minimum Trace Width / Spacing |
3/3 mil at 0.5 oz base copper |
3/3 mil, optimized for fine-line structures |
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Warp & Twist Control |
≤0.75% |
≤0.50%, with tighter control for assembly |
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Solder Mask Options |
Green, black, blue, red, white, and yellow, Matte or glossy finishes available |
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Surface Finishes |
Lead-Free HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
ENEPIG, hard gold plating, electroless soft gold |
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Impedance Control |
±10% or ±5 Ω for low-impedance nets |
±5%, with strict impedance matching available |


Challenge: Repeated heating, moisture, and high-temperature processing can increase the risk of delamination or resin degradation. Poor material selection and storage can add to these risks.
Our Solution: We control lamination parameters according to the selected laminate system, including temperature, pressure, vacuum, and curing conditions. Proper material storage and handling are also maintained to support consistent bonding quality and reduce process-related delamination risks.

Challenge: Thermal stress can cause PCB warpage and dimensional movement. This may affect SMT assembly, BGA soldering, connector fit, and mechanical installation.
Our Solution: We review stackup construction, copper distribution, board thickness, and layer symmetry during DFM. Controlled lamination and panel processing help maintain dimensional accuracy and reduce warpage during fabrication and assembly.

Challenge: Repeated heating and cooling can cause expansion and contraction that stress plated through-hole barrels. This may increase the risk of barrel cracking and other reliability issues.
Our Solution: During DFM, we review the selected material system, board thickness, hole structure, and aspect ratio. Controlled drilling, desmear, and copper plating processes help maintain reliable hole-wall quality and reduce stress on plated through-hole connections.

Challenge: Some High-Tg materials, especially polyimide, can absorb more moisture than standard FR-4. Moisture can affect lamination, drilling, and soldering if it is not properly controlled.
Our Solution: MedPCB maintain controlled storage conditions for moisture-sensitive materials and apply pre-baking when required by the material manufacturer's specifications. During fabrication, controlled lamination and handling procedures help minimize moisture-related defects.

MedPCB supports a range of High-Tg laminates for medical PCBs that require reliable performance under heat and long operating cycles. Available materials include Rogers, Isola, Panasonic Megtron, and Shengyi options.
|
Material |
Tg Value |
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Isola FR408HR |
180°C |
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Isola 370HR |
180°C |
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Panasonic Megtron 6 |
185°C (DSC) |
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Shengyi S1000-2M |
180°C (DSC) |
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IT-180A |
175°C (DSC) |
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Shengyi S1000-2 |
170°C (DSC) |
MedPCB supports your medical High-Tg PCB projects with expert material selection, free DFM review, and ISO 13485 and IPC Class 2/3 compliant manufacturing. Contact us for an instant quote.
Our Medical Metal High-Tg FAQ addresses essential questions regarding your manufacturing requirements. We cover our capabilities for complex medical electronics, supply chain management, assembly timelines, rigorous quality inspection protocols, and our capacity to scale from initial builds to production batches. For every medical device project, we guarantee precision-focused, medical-grade assembly standards.
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