Medical PCBs fabricated with genuine Shengyi SH260 high-performance polyimide laminate for long-term high-temperature medical applications.
• Tg >250°C for High-Temperature Medical PCB Applications
• Low Z-Axis CTE for Reliable Plated Through-Holes
• Halogen-Free Polyimide System for Lead-Free Processing
• Supports multilayer rigid PCB up to 40 layers
• ISO 13485 & IPC Class 3 Manufacturing
Shengyi SH260 is a halogen-free rigid polyimide copper-clad laminate. It is built for printed circuit boards that operate continuously at high temperatures. The system pairs SH260 rigid cores with SH260B prepreg, so a full multilayer polyimide PCB comes from one qualified resin family.
Medical device projects select SH260 for its outstanding thermal robustness. Unlike standard epoxy‑based substrates, it resists performance degradation caused by sustained high‑heat operation, repeated sterilization cycles, and extended burn‑in testing. MedPCB fabricates HDI and multilayer PCBs built with genuine Shengyi SH260 material for high-reliability medical projects.
MedPCB operates under an ISO 13485-certified quality management system and ISO 9001 quality management system. We manufacture SH260 PCBs to IPC Class 2/3 requirements, with controlled production processes and documented quality records for your medical device projects.
Our engineering team provides a free DFM review before production. We check your PCB layout, stackup, material selection, drill design, trace geometry, annular rings, and other manufacturing requirements to identify potential issues early. For SH260 projects, we can also provide recommendations on material construction and stackup based on your operating requirements and target PCB performance.
We source genuine Shengyi SH260 laminate and SH260B prepreg through qualified supply channels. Material part numbers, thickness, copper weight, and lot information are verified before production to support material consistency and traceability throughout the manufacturing process.
MedPCB supports multilayer SH260 rigid PCB fabrication with sequential lamination, blind and buried vias, and laser-drilled microvias. Our engineering and production teams also support HDI rigid PCB requirements with application-specific process planning and tooling.
We perform full-layer AOI and E-test (flying probe / fixture) for continuity and isolation.
We offer impedance testing, microsection analysis, solderability and dimensional inspection per project specs.
All boards meet IPC-A-600 and IPC-6012. Thermal stress coupons are provided upon PO request, with lot-level records retained.
| Item | Rigid PCB |
|---|---|
| Base Material | Shengyi SH260 laminate with SH260B prepreg |
| Layer Count | 1-40 layers |
| Finished Board Thickness | 0.2-10 mm |
| Copper Thickness | Min 1/3 oz, Max 10 oz |
| Min Line/Space, Inner Layer | 3/3 mil (1/2 oz copper) |
| Min Line/Space, Outer Layer | 3.5/3.5 mil (1/2 oz copper) |
| Max Aspect Ratio (PTH) | 20:1 |
| Laser Via Diameter | 4-6 mil |
| HDI Structure | 1+n+1 to 3+n+3 (buried vias ≤ 0.3 mm) |
| Max Board Size | 1100 × 500 mm (43" × 19") |
| Impedance Control | ±5Ω (< 50Ω), ±10% (≥ 50Ω) |
| Surface Treatment | ENIG, ENEPIG, Hard/Soft Gold, Immersion Tin, OSP |
Polyimide absorbs atmospheric moisture more readily than epoxy, and trapped moisture vaporises at lamination or reflow temperature. The resulting pressure causes measling, blistering, or delamination that often passes electrical test and appears only at thermal stress or assembly.
Our Solution: We bake SH260 laminate and prepreg before lamination, before drilling, and again before solder mask, retaining the oven charts. Conditioned material sits in controlled humidity storage under time-out-of-bake limits, and microsection after lamination confirms no voiding.
Polyimide needs a longer, hotter cure than epoxy to reach full crosslink density. An undercured stack holds a lower transition temperature and weaker bond strength, which surfaces later as interlayer separation or pad lifting during rework.
Our Solution: We run a dedicated polyimide press programme with controlled heat-up, extended dwell, and a separate post-cure bake, logging platen temperature and pressure per book. Cure adequacy is confirmed on production material by transition temperature verification and microsection review before the lot moves to drilling.
Polyimide and its glass reinforcement wear drill bits faster than epoxy laminate. A dulled bit adds heat and produces rough walls, nail-heading, and heavy smear, which cause plating voids that pass continuity test and fail during thermal cycling.
Our Solution: We set bit life limits specifically for polyimide and control chip load, retraction rate, and entry and backup material selection. Wall roughness and nail-heading are assessed on first-article microsections against IPC-A-600, and the drill programme is adjusted before production panels are committed.
Polyimide resists permanganate desmear chemistry tuned for epoxy, so a standard cycle can leave smear at the inner layer interface. Residual smear creates connections that read continuous at test and open under thermal load, while an aggressive cycle causes glass fibre protrusion and wicking.
Our Solution: We use a desmear process qualified for polyimide, holding swell solvent concentration, permanganate strength, bath temperature, and immersion time to defined limits. Smear removal and etch-back are verified by microsection at the barrel-to-innerlayer interface on every production lot.
The table below lists published typical values for Shengyi SH260 laminate and SH260B prepreg. Testing follows IPC-TM-650 on 1.6 mm specimens unless otherwise noted.
| Property | Shengyi SH260 | Method / Condition |
|---|---|---|
| Material Type | Halogen-free polyimide copper clad laminate and prepreg | SH260 laminate / SH260B prepreg |
| Specification | IPC-4101D /40, /41 | |
| Glass Transition Temperature (Tg) | >250°C | TMA, 2.4.24 |
| Decomposition Temperature (Td) | 429°C | 5% wt. loss, TGA, 2.4.24.6 |
| Time to Delamination (T300) | >60 min | TMA, 2.4.24.1 |
| CTE (X/Y-axis) | 12~15 ppm/°C | 50-260°C, 2.4.24 |
| CTE (Z-axis) | 45 ppm/°C (α1, below Tg) / 1.20% | 50-260°C, 2.4.24 |
| Dielectric Constant (Dk) | 4.12 | 1 GHz, C-24/23/50, 2.5.5.9 |
| Dissipation Factor (Df) | 0.007 | 1 GHz, C-24/23/50, 2.5.5.9 |
| Electrical Strength | 85 kV/mm | D-48/50 + D-0.5/23, 2.5.6.2 |
| Water Absorption | 0.26% | D-24/23, 2.6.2.1 |
| Flammability | UL 94 HB | C-48/23/50 |
| Halogen Content | Halogen-free, RoHS and WEEE compliant | |
| Lead-Free Process Compatible | Yes | Non-MDA cured resin system |
Need a Shengyi SH260 polyimide PCB for a high-temperature medical program? Send Your Gerber Files for a Free DFM Review.
A surgical instrument programme needed a compact four-layer board for a reusable handpiece rated for repeated steam autoclave exposure. We fabricated it on SH260 with SH260B prepreg, using an extended polyimide press cycle and a controlled pre-bake at each thermal step. ENIG was selected for storage stability between sterilization cycles. Before shipment we microsectioned thermal stress coupons to check for delamination and barrel cracking, and dimensional inspection verified outline and hole position.
This medical sterilizer controller required a 12‑layer SH260 polyimide PCB with mixed‑signal and power planes for continuous high‑temperature cabinet operation. We fabricated the multilayer stack‑up in a single lamination cycle, applying shrinkage‑based etch compensation and building PTH vias to IPC Class 3 requirements, with microsection validation and full‑net flying‑probe testing implemented for reliability. The finished boards delivered stable electrical performance under the device’s repeated thermal cycling conditions.
An implantable device programme needed a burn-in fixture board that would hold socket coplanarity through extended operation at temperature. We produced it on SH260 with increased inner copper cross-section for current distribution and a symmetrical stackup to control warp. Hard gold went on the contact areas to withstand repeated socket insertion. Flatness was measured after final bake against our advanced warp and twist window, gold thickness was verified by X-ray fluorescence, and continuity testing ran at full coverage.
A diagnostic equipment manufacturer required bare boards released against IPC-6012 Class 3, with documentation suited to its device master record. We built them under our ISO 13485 system, recording laminate and prepreg lot identifiers against each work order. Press, plating, and bake records were retained per panel. Acceptance covered AOI on all layers, microsection review against IPC-A-600 Class 3 criteria, and E-test, with the certificate of conformance and microsection report supplied at shipment.
Our Medical SH260 PCB FAQ addresses key questions regarding Shengyi SH260 polyimide laminate properties and fabrication standards. We cover thermal stability, high Tg performance, UL 94 HB flammability ratings, hybrid stackups, IPC Class 3 compliance, pre-bake requirements, and sterilization considerations. For every medical SH260 PCB project, we guarantee high-precision manufacturing engineered for critical healthcare applications.
SH260 is a polyimide system and high-Tg FR-4 is an epoxy system, and the difference matters most in sustained high-temperature service rather than in a single reflow event. The table below sets out the practical distinctions.
| Characteristic | Shengyi SH260 (Polyimide) | High-Tg FR-4 (Epoxy) |
|---|---|---|
| Glass Transition Temperature | >250°C (TMA) | Typically 170-180°C |
| Z-Axis Expansion, 50-260°C | 1.20% | Higher, greater barrel strain |
| Time to Delamination at 300°C | >60 min | Shorter |
| Dielectric Constant at 1 GHz | 4.12 | Broadly comparable |
| Water Absorption | 0.26%, pre-bake required | Lower, pre-bake advisable |
| Flammability | UL 94 HB | UL 94 V-0 |
| Relative Material Cost | Higher | Lower |
| Typical Application | Burn-in boards, sterilizers, electrosurgical, aerospace | General medical and commercial electronics |
Requirements outside these windows are reviewed case by case: send your operating temperature profile and we will advise which system fits.
4–40 layers
Supports 1+N+1, 2+N+2, and Any-Layer HDI
Microvias, Fine Lines, and Sequential Lamination
4–40 layers
Standard: 500 × 600 mm (19" × 23") Advanced: 1100 × 500 mm (43" × 19")
High-Tg FR4, Rogers, Polyimide, Megtron, Taconic, Arlon
1 to 8 Layers
Static 3-6x (1L) | Dynamic 20-40x
Polyimide (PI), FR4, 3M Tape
Up to 20 Rigid Layers, Up to 18 Flex Layers
Ultra-Long & Ultra-Thin HDI Rigid-Flex
Flex-to-Install & Dynamic Flex options
High-Precision SMT, Low-Temperature Reflow, Selective Soldering
Micro-SMD, Fine-Pitch BGAs, Connectors, QFNs, Sensors
Single-Sided Flex, Double-Sided Flex, Multi-Layer Flex
Panasonic MEGTRON 6 R-5775/R-5670
Ultra-Low Transmission Loss & High Heat Resistance
ISO 13485, IPC Class 2 and Class 3
1–4 layers
Min ½ OZ, Max 4 OZ standard; Min ⅓ OZ, Max 100 OZ advanced
Aluminum, FR4, copper, ceramic, polyimide, polyester, glass, and hybrid laminates
High Thermal Stability & Low Moisture Absorption
Dk 3.5 & Low Df for Low-Loss Signal Transmission
ISO 13485, IPC Class 2 and Class 3
Isola 370HR HDI Technology and Lead-Free Assembly
180°C Tg and 340°C Td
ISO 13485, IPC Class 2 and Class 3
01005 (0.4mm*0.2mm)
Support SMT & Thru-hole
Turnkey, Partial turnkey, Consigned
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