
Engineered for healthcare applications, our HDI boards deliver outstanding precision, stability, and long-term reliability. Advanced processes and strict quality control ensure consistent performance, supporting complex designs required in critical and high-performance medical systems.
| Specifications | PCB Capabilities |
|---|---|
| PCB Layers | 4 ~40 layers |
| High-Density Layers | Up to 36 layers |
| Delivery Time | 1 day to 3 weeks |
| Stackup | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating |
| PCB Via | Blind via, Buried via, Staggered via, Stacked via, Skip via |
| Minimum Laser Drill Diameter | 0.1mm |
| Final PCB Thickness | 0.4-10mm |
| Min BGA Pad Size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) |
| Copper Thickness | 1/2oz - 10oz |
| Surface Finishes | ENIG, Hard gold, Flash gold, HASL Lead free, OSP, ENEPIG, Soft gold, Immersion silver, Immersion Tin |
| Materials | Megatron 6&7, Shengyi S1000-2, Rogers 4350B, 4003C, 6035HTC, TU768, 370HR, FR408, IT180 |
| Impedance Control | ±5ohm(<50ohm), ±10%(≥50ohm) |
| Max. Board Size | 500*600mm(19''*23'') |
| Silkscreen | White, Black, Red, etc. |
| Soldermask | Green, Blue, Purple, White, Black, Pink, Orange |






Explore answers to common questions about our HDI PCB manufacturing capabilities, including precision, layer density, reliability, and suitability for complex applications. This helps clients quickly understand our technical strengths and production expertise.
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