MedPCB manufactures Rogers 6035HTC PCBs for medical electronics that require high RF power handling, low signal loss, and effective thermal management.
• 1.44 W/m/K Thermal Conductivity, suitable for medical high‑power RF applications
• Low Df of 0.0013 at 10 GHz for Low-Loss Signals
• Dk 3.50 ± 0.05 for Stable RF Performance
• Ceramic‑Filled PTFE PCB Fabrication
• ISO 13485 & IPC Class 2/3 Manufacturing
Rogers RT/duroid 6035HTC is a ceramic-filled PTFE composite laminate for high-power RF and microwave circuits. The HTC designation refers to its high thermal conductivity filler system, which raises thermal conductivity well above that of the standard RT/duroid 6000 grades while keeping the low dielectric loss expected of a PTFE microwave material.
Medical RF equipment is usually limited by heat rather than loss. Ablation generators and electrosurgical output stages dissipate real power, and 6035HTC carries that heat out of the dielectric while keeping microwave loss low. The tight dielectric tolerance matters too, since a validated device is built to a frozen design and needs electrical length to repeat across lots.
MedPCB fabricates single-sided, double-sided, multilayer PTFE, and PTFE/FR-4 hybrid boards on genuine Rogers 6035HTC for medical device programs, with lot-level material traceability and production records aligned to ISO 13485.
We build 6035HTC boards under ISO 13485 and ISO 9001 certification. Every panel lot carries recorded process data for plasma treatment, drilling, lamination, and plating. Boards are inspected to IPC-6012 Class 2 or Class 3. Device history record support, deviation handling, and change control follow your supplier quality agreement.
Our engineering team reviews your Gerber files, stackup, drill data, and fabrication requirements before production. We check trace width and spacing, dielectric thickness, drill-to-copper clearance, annular rings, impedance requirements, and other manufacturability details for PTFE and high-frequency PCB fabrication. We then provide DFM feedback based on the specified board construction.
We source genuine Rogers RT/duroid 6035HTC in the required laminate thickness, copper weight, and foil type. Material certificates and lot information are maintained for production traceability and quality control.
We support multilayer PTFE PCB fabrication and hybrid constructions that combine high-frequency materials with conventional PCB materials where required by the design. Our engineering team evaluates the stackup, material compatibility, dielectric thickness, copper distribution, and thermal expansion before production to support reliable multilayer fabrication.
Hole walls are where PTFE boards fail. We drill with parameters developed for filled PTFE, activate every hole wall by plasma before electroless copper, and confirm hole wall quality by microsection on production panels, not only on first articles.
We use AOI, electrical testing, dimensional inspection, and other inspection methods according to the PCB design and customer requirements. X-ray inspection, impedance testing, microsection analysis, and reliability testing are available for projects that require additional process verification. Inspection records and material traceability documents can be provided according to the agreed quality plan.
| Capability | Standard | Advanced |
|---|---|---|
| PCB Type | Rigid PCB, rigid-flex; heavy copper, blind & buried via, backdrill | |
| Layer Count | 1–20 layers | 22–40 layers |
| Finished Board Thickness | 0.2–3.2 mm | 3.4–10 mm |
| Max. Board Size | 500 × 600 mm (19″ × 23″) | 1100 × 500 mm (43″ × 19″) |
| Copper Thickness | 1/2 oz min, 4 oz max | 1/3 oz min, 10 oz max |
| Min. Trace / Space, outer layer | 3.9 / 4.5 mil (1/2 oz); 4.8 / 5 mil (1 oz) | 3.5 / 3.5 mil (1/2 oz); 3 / 3 mil (1/3 oz) |
| Min. Trace / Space, inner layer | 3 / 3 mil (1/2 oz); 3 / 4 mil (1 oz) | Same |
| Max. Aspect Ratio, PTH | 10:1 (hole diameter > 8 mil) | 20:1 |
| Min. Laser Drill | 4 mil | 4 mil |
| Hole Position Tolerance | ±2 mil | ±2 mil |
| Outline Tolerance | 0.15 mm (6 mil) | 0.10 mm (4 mil) |
| Warp and Twist | 0.75% | 0.50% |
| Impedance Control | ±5 Ω (< 50 Ω), ±10% (≥ 50 Ω) | |
| Surface Finish | ENIG, ENEPIG, soft gold, hard gold, flash gold, immersion silver, immersion tin, OSP, HASL lead-free; ENIG+OSP and gold finger combinations | |
| Standards | IPC-6012 Class 2 / Class 3, IPC-A-600, ISO 13485, ISO 9001 | |
PTFE-based laminates require specialized drilling and hole preparation to achieve reliable copper plating. Poor hole-wall preparation can affect plating adhesion and long-term interconnection reliability.
Our Solution: MedPCB uses PTFE-specific drilling and hole preparation processes before copper plating. We control hole quality and plating conditions throughout fabrication, with microsection analysis and electrical testing performed according to the project requirements.
PTFE is a soft matrix that smears under heat, so a dulling bit or an excessive feed rate leaves resin on the hole wall and blocks plating adhesion. The material is also less rigid than epoxy laminate, so drill deflection on thicker panels appears as annular ring breakout on the layers furthest from the entry side.
PTFE requires a higher lamination temperature than epoxy systems and moves differently through the cycle, so layer-to-layer registration drifts in ways that FR-4 process settings do not predict. In hybrid stackups the expansion mismatch between PTFE and epoxy adds warp and concentrates stress at the interface.
At microwave frequencies most conductor loss occurs at the copper-dielectric interface, so foil roughness, etched sidewall profile, and surface finish all contribute to measured insertion loss. A board that meets its dimensional drawing can still miss its loss budget, and this is usually found during system-level testing.
The table below lists published typical values for Rogers RT/duroid 6035HTC ceramic-filled PTFE laminate. Testing follows IPC-TM-650 standard test procedures unless otherwise noted.
| Property | Rogers RT/duroid 6035HTC | Method / Condition |
|---|---|---|
| Dielectric Constant (Process Dk) | 3.50 ± 0.05 | 10 GHz, 23°C, IPC-TM-650 2.5.5.5 |
| Design Dielectric Constant (Design Dk) | 3.60 | Differential Phase Length Method, 8-40 GHz |
| Dissipation Factor (Df / tan δ) | 0.0013 | 10 GHz, 23°C, IPC-TM-650 2.5.5.5 |
| Thermal Conductivity | 1.44 W/m/K | 80°C, ASTM C177 |
| Thermal Coefficient of Dk (TC Dk) | -65 ppm/°C | 10 GHz, -50°C to 150°C, IPC-TM-650 2.5.5.5 |
| Coefficient of Thermal Expansion (CTE, X/Y-Axis) | 19 / 19 ppm/°C | 0°C to 100°C, IPC-TM-650 2.4.41 |
| Coefficient of Thermal Expansion (CTE, Z-Axis) | 39 ppm/°C | 0°C to 100°C, IPC-TM-650 2.4.41 |
| Decomposition Temperature (Td) | >500°C | TGA, 5% weight loss |
| Water Absorption | 0.06% | D-24/23, IPC-TM-650 2.6.2.1 |
| Volume Resistivity | 2.0 × 107 MΩ·cm | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 3.0 × 107 MΩ | IPC-TM-650 2.5.17.1 |
| Flammability Rating | V-0 | UL 94 |
| Copper Foil Options | Reverse-Treated Electrodeposited (Electrodeposited / Treated) | 1/2 oz (18 µm), 1 oz (35 µm), 2 oz (70 µm) |
| Standard Thicknesses | 0.010″, 0.020″, 0.030″, 0.040″, 0.060″ | Dielectric Thickness Tolerances apply |
Need a Rogers RT/duroid 6035HTC high-frequency PTFE PCB for a high-power medical RF program? Send Your Gerber Files for a Free DFM Review.
The project required stable antenna performance in a high layer count build with limited board area. MedPCB fabricated the 12-layer PCB according to the customer's stackup, impedance, dimensional, and inspection requirements, including the specified material assignment and copper weights for each layer pair. Controlled-impedance testing, electrical test, and production inspection were performed where specified by the project.
The governing requirements here were dissipation at the output stage and clearance at the high-voltage nodes. We built a hybrid stackup with 6035HTC on the RF and power layers over FR-4 cores, with a thermal via array under the output devices sized and plated for the through-thickness expansion of the laminate. Spacing and mask coverage were verified against the customer's stated working voltage, and the lot was released after thermal stress coupons, AOI, and microsection.
The project required consistent electrical performance across multiple RF channels. MedPCB manufactured the Rogers 6035HTC PCB according to the customer's stackup, impedance, dimensional, and inspection requirements. Controlled-impedance testing and production inspection were performed where specified by the project.
The project required full material traceability alongside its electrical requirements. MedPCB manufactured the Rogers 6035HTC PCB according to the customer's stackup, surface finish, inspection, and documentation requirements, building a 6-layer rigid board at 0.80 mm finished thickness with 1 oz outer copper, an ENEPIG surface finish, and impedance controlled to 50 Ω ±10%. Lot traceability records and production inspection reports to IPC-6012 Class 3 were provided where specified by the project.
Our Medical Rogers 6035HTC PCB FAQ addresses key questions regarding Rogers RT/duroid 6035HTC ceramic-filled PTFE laminate properties and fabrication standards. We cover dielectric constants, thermal conductivity, RoHS/REACH compliance, hybrid stackups, IPC Class 3 compliance, CAF resistance, and sterilization considerations. For every medical Rogers 6035HTC PCB project, we guarantee high-precision manufacturing engineered for critical healthcare applications.
FR-4 is woven-glass epoxy with a dielectric constant that varies with weave position and a dissipation factor roughly an order of magnitude higher. 6035HTC is ceramic-filled PTFE with controlled tolerance, low microwave loss, and high thermal conductivity, in exchange for plasma hole activation and high-temperature bonding. The table below outlines the core material differences:
| Characteristic | Rogers RT/duroid 6035HTC | Standard FR-4 (Epoxy) |
|---|---|---|
| Dielectric Constant (Dk at 10 GHz) | 3.50 ± 0.05 (Process Dk) | Typically 4.2–4.8 (Variable) |
| Dissipation Factor (Df at 10 GHz) | 0.0013 | Typically 0.015–0.020 (Higher Loss) |
| Thermal Conductivity | 1.44 W/m/K | Typically 0.25–0.30 W/m/K |
| Z-Axis Expansion (CTE) | 39 ppm/°C | 50–70 ppm/°C (Higher Strain) |
| Moisture Absorption | 0.06% | 0.10–0.20% |
| Typical Application | High-power medical RF, microwave ablation, MRI coils | General digital and low-frequency medical electronics |
1 to 8 Layers
Static 3-6x (1L) | Dynamic 20-40x
Polyimide (PI), FR4, 3M Tape
Up to 20 Rigid Layers, Up to 18 Flex Layers
Ultra-Long & Ultra-Thin HDI Rigid-Flex
Flex-to-Install & Dynamic Flex options
High-Precision SMT, Low-Temperature Reflow, Selective Soldering
Micro-SMD, Fine-Pitch BGAs, Connectors, QFNs, Sensors
Single-Sided Flex, Double-Sided Flex, Multi-Layer Flex
Panasonic MEGTRON 6 R-5775/R-5670
Ultra-Low Transmission Loss & High Heat Resistance
ISO 13485, IPC Class 2 and Class 3
1–4 layers
Min ½ OZ, Max 4 OZ standard; Min ⅓ OZ, Max 100 OZ advanced
Aluminum, FR4, copper, ceramic, polyimide, polyester, glass, and hybrid laminates
High Thermal Stability & Low Moisture Absorption
Dk 3.5 & Low Df for Low-Loss Signal Transmission
ISO 13485, IPC Class 2 and Class 3
Isola 370HR HDI Technology and Lead-Free Assembly
180°C Tg and 340°C Td
ISO 13485, IPC Class 2 and Class 3
4–40 layers
Standard: 500 × 600 mm (19" × 23") Advanced: 1100 × 500 mm (43" × 19")
High-Tg FR4, Rogers, Polyimide, Megtron, Taconic, Arlon
4–40 layers
Supports 1+N+1, 2+N+2, and Any-Layer HDI
Microvias, Fine Lines, and Sequential Lamination
01005 (0.4mm*0.2mm)
Support SMT & Thru-hole
Turnkey, Partial turnkey, Consigned
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