TU768 is a high-Tg FR-4 laminate by TUC, providing top-tier thermal stability and anti-CAF reliability for medical devices. At MedPCB, we use TU768 in our ISO 13485 facilities to build IPC Class 3 multilayer HDI boards.
• High-Tg FR-4 Laminate for Thermal Stability
• Anti-CAF Performance for Long-Term PCB Reliability
• Low CTE for Multilayer Reliability
• UL 94 V-0 & RoHS Compliant
• ISO 13485 & IPC Class 3 Manufacturing
A TU768 PCB is a printed circuit board built on Taiwan Union Technology Corporation TU768, a high-performance FR-4 material formulated with a specialized epoxy resin system over high-quality woven E-glass. The material family encompasses the TU-768 core, TU-768P TU768 prepreg, and TU-768 copper-clad laminate components.
These properties make TU-768 suitable for medical electronics that require stable performance through repeated thermal cycling, lead-free assembly, and long-term operation.
MedPCB manufactures custom TU768 PCBs with controlled multilayer fabrication, material traceability, and IPC Class 2/3 production support.
MedPCB manufactures TU768 PCBs under an ISO 13485-certified quality management system, with controlled production processes and documented quality records for medical device projects.
We provide a free DFM review for your TU768 PCB files before production. Our engineering team checks key manufacturing requirements, including trace and spacing, drill sizes, annular rings, layer alignment, and board stackup. Helping you identify design flaws early on can help eliminate errors before entering production.
MedPCB supports TU768 PCB fabrication and assembly to IPC Class 2 and Class 3 requirements. We provide PCB manufacturing and PCBA services for medical electronics requiring high reliability and consistent production quality.
We maintain a premium, stable supply chain with direct sourcing of authentic TUC TU768 raw materials from Taiwan Union Technology. All substrates are 100% genuine and factory-certified. We enforce full lot-to-lot material traceability throughout the entire manufacturing workflow.
MedPCB applies multiple inspection and testing methods throughout TU768 PCB production. Depending on the project requirements, quality control may include AOI, X-ray inspection, electrical testing, impedance testing, and microsection analysis.
| Parameter | Standard Capability | Advanced Capability |
|---|---|---|
| Layer Count | 1-20 layers | 22-40 layers |
| Finished Board Thickness | 0.20-3.20 mm | 3.40-10.0 mm |
| Copper Thickness | 0.5-4 oz | 0.33-100 oz |
| Minimum Line/Space (1/2 oz) | 0.10/0.11 mm (3.9/4.5 mil) | 0.08/0.08 mm (3.5/3.5 mil) |
| Minimum Laser Drill (Blind Via) | 0.10 mm (4 mil) | 0.10 mm (4 mil) |
| Controlled Impedance Tolerance | ± 10% (≥ 50 ohm) | ± 5 ohm (< 50 ohm) |
| Maximum Panel Size | 500 x 600 mm | 1100 x 500 mm |
| Surface Finish | HASL Lead-Free, OSP | ENIG, ENEPIG, Immersion Ag / Sn |
TU768 high-Tg laminates feature rigid resin systems that generate uneven shrinkage during vacuum lamination. Rigid substrate behavior makes layer-to-layer registration difficult to control, easily leading to misalignment and compromised via connectivity in multilayer stacks.
Our Solution: We apply custom panel scaling compensation based on first-article verification data tailored for TU768 material shrinkage characteristics. All thin cores are mounted on precision pinned frames during lamination to minimize lateral shifting and ensure accurate inner-to-outer layer registration.
Contamination in the drill hole prevents the electroless copper from adhering to the inner layer connections. The resulting weak barrel fractures under the thermal shock of wave soldering, creating intermittent connections in the final assembly.
Our Solution: We run a tightly controlled alkaline permanganate desmear process customized for high Tg epoxy systems. Technicians pull test coupons from every production panel to verify interconnection integrity microscopically prior to shipment.
Substrates absorb atmospheric moisture when left unprotected on the production floor prior to the press cycle. Trapped moisture expands violently during high-temperature thermal stress testing, causing internal delamination and destroying layer bonds.
Our Solution: We conduct mandatory pre-lamination baking for all TU768 cores and prepregs to eliminate residual moisture. Finished bare boards are vacuum-packed with desiccants to prevent reabsorption during storage and transit, ensuring long-term thermal stability.
TU768 resin uniformity requires tightly balanced etching parameters. Uncontrolled chemical aggression causes inconsistent trace width reduction, shifting controlled impedance values and introducing signal integrity errors during device operation.
Our Solution: We maintain closed-loop control of etchant concentration, temperature, and conveyor speed for precise fine-line etching. Post-etch AOI metering verifies trace width consistency, stabilizing impedance performance for high-reliability medical applications.
The following table summarizes the thermal, electrical, mechanical, and physical properties of TU768 based on IPC-4101E/126 validation specifications.
| Property | Condition | Value |
|---|---|---|
| Glass Transition (Tg) | DSC | 180 °C |
| Decomposition Temp (Td) | TGA | 350 °C |
| Z-Axis Expansion (CTE) | 50 - 260 °C | 2.7 % |
| Thermal Stress (T288) | Solder Float, 288°C | > 15 min |
| Permittivity (Dk) | 1 GHz (RC 50%) | 4.3 - |
| Loss Tangent (Df) | 1 GHz (RC 50%) | 0.018 - |
| Water Absorption | E-1/105+D-24/23 | 0.18 % |
| Maximum Operating Temp | Continuous | 130 °C |
| Flammability Rating | UL 94 | V-0 Rating |
Need a TU768 PCB for your high-reliability medical electronics? Send us your Gerber files for a free DFM review and quote.
The customer needed a 12-layer PCB for a compact ultrasound platform with dense interconnections and controlled high-speed signal routing. For them we produced a 12-layer stackup utilizing very thin prepreg layers and controlled depth drilling. Every panel underwent automated optical inspection and time domain reflectometry testing prior to packaging.
The customer came to us with an ablation controller that required significant current-carrying capacity alongside sensitive digital logic. We handled it with sequential lamination and 3-ounce inner layer heavy copper weights. Netlist verification and IPC microsectioning confirmed structural integrity.
For this life-support client, the hospital environment demanded strict IPC Class 3 compliance and verified PCBA performance. Our facility built the boards with an ENIG surface finish to guarantee flat component mounting pads for final assembly. The boards passed strict continuity testing before release.
This customer requires high-resolution imaging modules that survive repeated hospital autoclaving, placing extreme stress on the substrate. We imaged precise controlled impedance lines and reinforced the through holes with extra copper deposition to prevent barrel fatigue. Final inspection included exact dimensional validation against the supplied drawing.
Our Medical TU768 PCB FAQ addresses key questions regarding TUC TU768 high-performance laminate properties and fabrication standards. We cover thermal stability, high-Tg characteristics, anti-CAF reliability, lead-free reflow compatibility, IPC Class 3 standards, and ISO 13485 manufacturing support. For every medical TU768 PCB project, we guarantee high-precision manufacturing engineered for critical healthcare applications.
Panasonic MEGTRON 6 R-5775/R-5670
Ultra-Low Transmission Loss & High Heat Resistance
ISO 13485, IPC Class 2 and Class 3
1–4 layers
Min ½ OZ, Max 4 OZ standard; Min ⅓ OZ, Max 100 OZ advanced
Aluminum, FR4, copper, ceramic, polyimide, polyester, glass, and hybrid laminates
High Thermal Stability & Low Moisture Absorption
Dk 3.5 & Low Df for Low-Loss Signal Transmission
ISO 13485, IPC Class 2 and Class 3
Isola 370HR HDI Technology and Lead-Free Assembly
180°C Tg and 340°C Td
ISO 13485, IPC Class 2 and Class 3
4–40 layers
Standard: 500 × 600 mm (19" × 23") Advanced: 1100 × 500 mm (43" × 19")
High-Tg FR4, Rogers, Polyimide, Megtron, Taconic, Arlon
4–40 layers
Supports 1+N+1, 2+N+2, and Any-Layer HDI
Microvias, Fine Lines, and Sequential Lamination
01005 (0.4mm*0.2mm)
Support SMT & Thru-hole
Turnkey, Partial turnkey, Consigned
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